Ultra-Prep diamond lapping films are designed for fine grinding of hard materials such as ceramic, microelectronic devices, wafers, optical fibers, petrographic specimens and other materials.

Only available to ship to AR, IA, KS, LA, MN, MO, MS, ND, NE, OK, SD, TX

ABRASIVE MATERIAL : Diamond
BACKING : Plain Backed
DIMENSIONS : 8 in [203 mm]
MICRON SIZE : 0.5 µm
PRODUCT FAMILY : UltraPrep Lapping Film
QTY/EA : 5