Ultra-Prep diamond lapping films are designed for fine grinding of hard materials such as ceramic, microelectronic devices, wafers, optical fibers, petrographic specimens and other materials. GRINDING & POLISHING CONSUMABLE

Only available to ship to AR, IA, KS, LA, MN, MO, MS, ND, NE, OK, SD, TX

ABRASIVE MATERIAL: Diamond
BACKING: Plain Backed
DIMENSIONS: 8 in [203 mm]
MICRON SIZE: 0.1 µm
PRODUCT FAMILY: UltraPrep Lapping Film
QTY/EA: 5